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Exhibiting at Pack Expo International USA, 2024

North Building — N-5719
Chicago, Illinois, USA
3 Nov - 6 Nov, 2024

Product Offerings

Product Categories:

Human-Machine Interfaces (HMI), RFID Systems, Interface Technology, Sensors, Fieldbus Technology, Connectivity

Products:

Ultrasonic Sensors, Flow Sensors, I/O Systems, Signal Conditioners, Capacitive Sensors, Fieldbus Modules, HMI Panels, Cables and Connectors, Inductive Sensors, RFID Readers and Tags, Pressure Sensors

When your packaging and processing application demands the highest standards of reliability and cleanliness, Turck provides high IP rated automation solutions to get the job done. From monitoring changeover processes on lines to detecting bottle caps on a filling and capping machine, we offer a rugged solution that stands up to harsh processes. Turck has a wide range of reliable automation products - including sensors, industrial cordsets, distributed I/O products and RFID to tackle whatever packaging automation challenges you are facing.